Apple is often the first to the starting line when it comes to shrinking silicon, and its partnership with TSMC is a key reason behind that lead. While we are currently settling into the 2nm era, the roadmap for what comes next is already coming into focus. A new report reveals TSMC is eyeing the sub-1nm milestone with a target for trial production as early as 2029.
TSMC’s silicon roadmap leading to sub-1nm chips
According to DigiTimes, the move to sub-1nm won’t be a single leap. Following the successful start of 2nm mass production late last year, TSMC is already looking toward its next milestone. The foundry plans to move to the 1.4nm node in 2028, which is said to deliver 15 percent improved performance and 30 percent better power efficiency.
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The sub-1nm process will arrive next, with TSMC already readying its Tainan A10 facility
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